Manufacturing Process

●The circuit substrate and backplane are soldered. The solder is solder paste, or solder lug.

●The bonding process is adopted between the circuit substrate, support medium, compensation sheet, and permanent magnet.

●The cavity adopts duralumin conductive oxidation treatment.

●The screw connection process is adopted between the cavities.

●The bonding process is adopted between ferrite substrate, support medium, compensation sheet, permanent magnet and cavity

●The Drop-in circuit is beryllium bronze plated with gold or copper and silver.

●The resistance and cavity adopt welding process, the solder is solder paste, and the welding temperature is 205 °C.

●The bonding process is adopted between the ferrite substrate, support medium, compensation sheet, permanent magnet and magnetic circuit, and the adhesive is X98-11 acetal drying glue, and the curing temperature is 150 °C.

●The coating layer of the product shell is: industrial pure iron copper plating nickel plating.

●The coaxial product has connectors added on top of the Drop-in product.