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Keywords: microstrip circulator price, RF circulator cost, microstrip circulator cost, RF isolator price, RF circulator price list, custom RF circulator, OEM ODM RF components
A long-form, engineer-first report linking price to demand signals (automotive radar, NTN/LEO), design/test realities (S-parameters), and factory levers (volume, screening, lead time) — with charts and checkable references.
Microstrip circulators are non-reciprocal three-port devices that route power directionally (1→2, 2→3, 3→1) via magnetized ferrites. With one port terminated, they act as isolators guarding PAs against mismatch. Their planar integration advantage makes them a default for compact front-ends in 5G/6G radios, phased-array radar, SatCom user terminals, UAV links, and beyond.
Public technical literature and vendor notes underpin the definitions; this report focuses on how engineering targets map to cost and how verifiable market signals affect pricing power in 2025.
Key Points: Microstrip circulators achieve non-reciprocity through ferrite magnetization; compared to waveguide/coaxial designs, they offer greater planarization and miniaturization advantages, making them suitable for 5G, automotive radar, and satellite terminal applications. Pricing is influenced by frequency band/bandwidth, insertion loss/isolation, power handling, temperature range, packaging, certification, and MOQ/lead time. The prices mentioned in this document are for engineering reference only, with final pricing subject to RFQ confirmation.

Space/NTN milestones that reinforce terminal demand & RF front-end sourcing.
All milestones above are referenced in the list at the end of the article.
Vendors rarely publish list prices. The bands below are indicative for budgeting and SEO; finalize via RFQ against your IL/ISO/VSWR targets, environment, screening level, and volume.
| Band | Frequency (GHz) | Microwave Isolator | Primary Cost Drivers |
|---|---|---|---|
| L / S | ~1–4 | Entry-Level Commercial | Commodity-lean layouts; volume leverage; modest screening. |
| C / X | ~4–12 | Standard | Tighter IL/ISO; better materials; more test cycles. |
| Ku | ~12–18 | Advanced | Higher-freq sensitivity; layout/ferrite control; fixture time. |
| K / Ka | ~18–40 | Premium | High-end radar/SatCom; custom share & qualification. |

Relative levels only; exact quotes require final specs and volumes.
Higher bands and wider fractional bandwidths demand lower-loss dielectrics, refined ferrite biasing, and tighter tolerances.
Raising CW/PK power and extending temperature range (e.g., −40 °C to +125 °C) shifts materials, bias magnets, and thermal design.
Ultra-low IL & high ISO often require custom geometries, careful magnetization distribution, and extra screening.
Microstrip pads vs drop-in flanges vs coaxial connectors — alignment & machining lead to different assembly yields and costs.
Military/space-grade screening (lot traceability, burn-in, temp cycling) adds NRE and recurring QA overhead.
MOQ and delivery windows affect factory loading; pull-ins may require premium routing; schedule buffers反映到价格。
| Bucket | Elements |
|---|---|
| BOM | Ferrite puck, magnets, substrate/metalization, plating, adhesives, terminators, fasteners. |
| Process | PCB/laminate fab, machining/fixture, magnetization/bias set-up, bonding/soldering, cleaning. |
| Test | VNA time, fixturing, temperature sweep, data/reporting, re-work margin. |
| QA/Docs | Traveler, lot traceability, CoC, screening logs (burn-in, temp cycle) as required. |
| Scale | Yield curves, learning effects, automation, capacity utilization. |
Test time & screening can dominate high-spec/space-grade lots.

| Tier | Qty | Lead Time | Notes |
|---|---|---|---|
| Prototype | 5–30 | 3–6 weeks | Shared line; fastest feedback; unit price highest. |
| Pilot | 50–300 | 6–10 weeks | Yield learning; fixtures stabilize; price ↓. |
| Volume | 500–5k+ | 8–14 weeks | Best $/pc; screening agreed upfront. |
| Expedite | Any | −20–30% vs std | Premium routing; risk buffers priced in. |
Ranges reflect industry norms,Special military products and aerospace missions require separate production scheduling and qualification certification.
| Region | Strengths | Impact on Price |
|---|---|---|
| APAC | Scale, cost efficiency, rapid ramp; broad laminate ecosystem. | Standard specs;High-end screening requires a clear certification process. |
| North America | High-rel programs,doc rigor,test coverage is extensive. | High price; professional shielding/temperature cycling/reporting complete. |
| Europe | The aerospace/deterrent chain and the new NTN/LEO project drive. | When the certification process is complete but the production capacity is limited, the prices and cycles are under pressure. |
Pricing correlates with S-parameter difficulty. Industry measurement relies on Vector Network Analyzers (VNAs); .s2p/.s3p/.s4p Touchstone files are the lingua franca for design ↔ supplier correlation. Authoritative application notes (HP/Keysight) explain why network analyzers measure S-parameters and how to de-embed fixtures for trustworthy IL/ISO claims.
Attach your target S-parameters across temperature, fixture notes, and any qualification standard (e.g., thermal cycling profile). Quotes become faster and more precise.
Peer-reviewed work (Popović group, Univ. of Colorado) shows how the magnetization distribution and bias field impact microstrip Y-junction circulator bandwidth and isolation — a direct lever to price via complexity and screening.
| Scenario | Targets | Cost/Lead Implications |
|---|---|---|
| Ku-band SatCom terminal, compact layout | IL ≤ 0.5 dB; ISO ≥ 20 dB; −40–+85 °C | Custom geometry + thermal bias tweak; moderate screening; Median price, 8–10 weeks。 |
| K/Ka-band phased array radar tile | IL ≤ 0.4 dB; ISO ≥ 22 dB; −40–+125 °C; wide BW | High-end materials + tighter bias; temp cycles; doc package;High prices, 10–14 weeks。 |
| L/S-band industrial RF amp protection | ISO ≥ 18 dB; VSWR ≤ 1.3; CW power↑ | Robust termination + heat sinking;Significant cost reduction in mass production, 6–9 weeks。 |
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Standard commercial models see gradual efficiency from volume/process. High-end & custom (wide BW, low IL/high ISO, harsh temp, certified) can stay flat or rise due to screening & tighter tolerances.
Loss/tolerance, magnetization uniformity, and screening scale up at high frequencies; fixtures & de-embedding rigor add test time.
Target S-parameters vs temperature, fixture details, qualification standard, and lot documentation expectations.
OEM/ODM with DFM/CAE correlation, EVT/DVT builds, and scalable manufacturing is available; expect NRE for custom fixtures & screens.
About the Author
HzBeat Editorial Content Team
Marketing Director, Chengdu Hertz Electronic Technology Co., Ltd. (Hzbeat)
Keith has over 18 years in the RF components industry, focusing on the intersection of technology, healthcare applications, and global market trends.